THE GAAS IC MARKETS

Chapter 1 Introduction 1-1

Chapter 2 Executive Summary 2-1

2.1 Summary of Major Issues 2-1
2.2 Summary of Market Forecast 2-3

Chapter 3 Technology Issues 3-1

3.1 GaAs Devices 3-1
3.1.1 FETs 3-1
3.1.2 HEMTs 3-3
3.1.3 HBT 3-6
3.2 Comparison of Logic Structures 3-10
3.2.1 Buffered FET Logic 3-12
3.2.2 FET Logic 3-12
3.2.3 Capacitively Enhanced Logic 3-15
3.2.4 Direct-Coupled FET Logic 3-15
3.2.5 Source-Coupled FET Logic 3-17
3.3 Material Issues 3-20
3.3.1 Wafer Production 3-20
3.3.2 Etch Pit Densities 3-25
3.4 Equipment 3-29
3.4.1 Implanters 3-42
3.4.2 Lithography 3-43
3.4.3 Etching 3-44
3.4.4 Deposition 3-46
3.4.5 Rapid Thermal Processing 3-47
3.5 Packaging 3-47
3.5.1 Package Types 3-49
3.5.2 Bonding 3-51
3.6 Testing 3-55
3.7 Design 3-56

Chapter 4 Applications for GaAs ICs 4-1

4.1 Introduction 4-1
4.1.1 The Trend Toward Higher Frequencies 4-3
4.1.2 Transition from Analog to Digital Modulation 4-3
4.1.3 Discrete Components and Silicon-Based ICs 4-4
4.2 Markets 4-7
4.2.1 Telecommunications Systems 4-7
4.2.2 Television Systems 4-13
4.2.3 Computing 4-14
4.2.4 Data Communications 4-15
4.2.5 Automotive 4-20
4.2.6 Automated Test Equipment 4-22
4.2.7 Military 4-23

Chapter 5 IC Supplier and End-User Issues 5-1

5.1 Introduction 5-1
5.2 Competing Against Silicon 5-3
5.3 Competing Against The Japanese 5-11
5.4 Taiwan’s Market Momentum 5-11
5.5 Korea’s Market Momentum 5-13
5.6 Wafer Sizes 5-19
5.7 Competing Against SiGe 5-22
5.7.1 Introduction 5-22
5.7.2 Technology 5-25
5.7.2.1 Strained Silicon 5-26
5.7.2.2 Device Manufacturing 5-36
5.7.3 Applications 5-38
5.7.3.1 Wireless LAN 5-38
5.7.3.2 WiMAX 5-38
5.7.3.3 Bluetooth 5-39
5.7.3.4 Cellular 5-39
5.7.3.5 GPS 5-52

Chapter 6 Market Forecast 6-1

6.1 Driving Forces 6-1
6.2 Market Forecast Assumptions 6-5
6.3 GaAs IC Market Forecast 6-7
6.4 SiGe IC Market Forecast 6-22
6.5 End Application Market 6-25

Chapter 7 Profile of GaAs IC Manufacturers 7-1

List of Tables

5.1 Cost Comparison for GaAs Structures 5-8
5.2 A Comparison of SiGe BiCMOS, RF CMOS, and InGaP/GaAs 5-37
6.1 Worldwide Merchant GaAs IC Market Forecast By Device Type 6-8
6.2 Worldwide Merchant Market Forecast By Geographical Region 6-11
6.3 Worldwide Merchant Market Forecast By Application 6-13
6.4 Market Shares of Merchant Participants - 2013 6-21

List of Figures

3.1 Schematic of GaAs MESFET 3-2
3.2 Schematic of GaAs HEMT Device 3-4
3.3 Schematic of GaAs HBT Device 3-8
3.4 Schematic of GaAs HBT Device 3-9
3.5 Symbolic Representations of Various GaAs Transistor Type 3-11
3.6 Schematic of BFL Logic Gate 3-13
3.7 Schematic of FETL Logic Gate 3-14
3.8 Schematic of CEL Logic Gate 3-16
3.9 Schematic of DCFL Logic Gate 3-18
3.10 Schematic of SCFL Logic Gate 3-19
3.11 Full wafer EPD mapping of LEC and VGF wafers 3-27
3.12 Mesoscopic EL2 mapping of LEC and VGF wafers 3-28
3.13 pHEMT MMIC Process Flow Chart 3-31
3.14 0.15 Micron 3MI Process Cross Section 3-37
3.15 InGaP HBT Process 3-40
5.1 Comparison of Die Costs of Si and GaAs 5-6
5.2 Strained Silicon Germanium Technology 5-28
5.3 Fourth Generation Of Strain Technology 5-32
5.4 Performance Versus Germanium Content 5-33
5.5 Bulk Versus SOI Strain Method 5-34
6.1 Worldwide Merchant GaAs IC Market Forecast 6-9
6.2 Worldwide GaAs Merchant Market Forecast By Geographical Region 6-12
6.3 Worldwide GaAs Merchant Market Forecast By Application 6-14
6.4 Global Handset Market 6-16
6.5 Migration Of PA’s In Handset Market 6-18
6.6 CMOS Replacement Of Bipolar And GaAs 6-19
6.7 Worldwide SiGe Market Forecast 6-23